Olympus MXPLFLN-BD 50X Objective – 0.80 NA, 3 mm WD Plan Fluorite BF/DF

The Olympus MXPLFLN-BD 50× Objective represents the pinnacle of industrial microscopy optics at high magnification, combining ultra-high numerical aperture, exceptional field flatness, and dual brightfield/darkfield capability in a single premium lens. With a remarkable 0.80 numerical aperture at 50× magnification, this objective delivers resolution and light-gathering performance that sets the standard for maximum detail imaging.

The MXPLFLN series is Olympus's flagship line for high-resolution industrial imaging, specifically engineered for applications requiring the highest image quality and field uniformity. The ultra-high 0.80 numerical aperture provides exceptional resolution, revealing the finest details in microstructures, grain boundaries, defects, and surface features with clarity that exceeds standard 50× objectives. This makes it indispensable for semiconductor failure analysis, advanced metallography, and precision materials characterization.

Superior field flatness is a defining characteristic of the MXPLFLN series. Unlike conventional objectives where image quality degrades toward the edges, this objective maintains exceptional sharpness and uniformity from the center to the periphery of the field of view. This feature is critical for image stitching applications, where multiple overlapping fields are combined to create large-area panoramic images. Consistent focus and illumination across the entire field ensure seamless stitching without visible boundaries or focus variations.

The dual brightfield/darkfield capability makes this objective exceptionally versatile for industrial inspection and quality control at high magnification. Brightfield illumination provides standard observation for general sample characterization, while darkfield reveals surface defects, scratches, contamination, and structural irregularities with exceptional contrast. Features invisible in brightfield become dramatically visible in darkfield, making this objective invaluable for semiconductor wafer inspection, precision machining quality control, and surface defect analysis.

The extended field of view provided by the MXPLFLN design allows you to observe a larger sample area at 50× magnification compared to standard objectives. This improves workflow efficiency by reducing the need for frequent stage repositioning and enables better contextual understanding of features within the broader sample structure. For production environments and high-volume inspection, this translates directly to increased productivity.

With a working distance of 3.0 mm, this objective provides good clearance for most standard samples while maintaining the ultra-high numerical aperture necessary for maximum resolution. This working distance is well-suited for polished metallographic specimens, semiconductor wafers, and other flat or near-flat samples commonly encountered in industrial microscopy.

Designed for reflected light industrial microscopy, this objective features an M26 thread mount and is fully compatible with Olympus BX, GX, MX, and BHM series microscope systems. The robust Japanese construction ensures reliable performance in demanding production and research environments where the highest image quality, precision, and repeatability are essential.