Olympus IX Inverted Reflected Light Industrial Microscope - DIC, BF, Pol
Regular price
$12,500.00
Sale price
$12,500.00
Regular price
$36,200.00
save $23,700.00
The Olympus IX Inverted Metallurgical Microscope is a fully configured, reconditioned industrial reflected light system equipped with a complete set of UMPlanFL objectives, DIC/Nomarski contrast, polarized light, and a 1x C-mount camera port — a turnkey solution for materials characterization, failure analysis, and semiconductor inspection.
KEY FEATURES
- 5-objective UMPlanFL set — 5x, 10x, 20x, 50x, and 100x infinity-corrected reflected light objectives
- DIC/Nomarski contrast — U-DICR Nomarski slider for high-contrast surface topography imaging
- Polarized light — polarized light filter cube for grain structure, stress, and anisotropy analysis
- Camera ready — trinocular port with 1x C-mount adapter for digital documentation
- Left-hand mechanical XY stage — precise specimen positioning for large sample navigation
- Reconditioned / excellent condition — professionally serviced and verified
- Custom configurations available — contact us to modify the setup for your application
- University purchase orders accepted
Backed by Spach Optics Warranty
Secure Packaging & Reliable Delivery
People-Powered Support
Technical Specifications
| Manufacturer | Olympus |
| Platform | IX Inverted Metallurgical Microscope |
| Objectives Included | UMPlanFL 5x/0.15 NA (WD 20mm), 10x/0.30 NA (WD 10.1mm), 20x/0.46 NA (WD 3.1mm), 50x/0.80 NA (WD 0.66mm), 100x/0.95 NA (WD 0.31mm) |
| DIC / Nomarski | U-DICR Nomarski Slider |
| Polarized Light | Polarized Light Filter Cube |
| Filter Turret | 4-position with Brightfield Cube installed |
| Illumination | Vertical Illuminator with Iris, 12V/100W Lamphouse & Power Supply |
| Stage | Left-hand Mechanical XY Stage |
| Eyepieces | 10x Widefield |
| Camera Port | 1x C-mount |
| Focus | Coarse and Fine Adjustment |
| Country of Origin | Japan |
| Condition | Reconditioned / Excellent |
Microscope Compatibility
Typical Applications
Metallographic analysis of grain structure, inclusions, and phase distribution
Semiconductor wafer and device inspection using reflected brightfield and DIC
Failure analysis and surface defect characterization on metals and alloys
Thin film and coating inspection with DIC/Nomarski contrast
Polarized light analysis of anisotropic materials, stress birefringence, and crystal structure
