Nikon T Plan SLWD 20x Objective

In stock

SKU: MUE31200

$3,600.00
The Nikon CFI60-2 T Plan Fluor EPI SLWD 20x Objective is an exceptional Super Long Working Distance (SLWD) objective engineered for reflected-light (EPI) applications where extended clearance between the lens and specimen is critical. With a 30mm working distance and N.A. 0.3, it delivers sharp, high-contrast imaging even when working with large, bulky, or encased samples.

KEY FEATURES

  • 20x magnification with N.A. 0.3 for balanced resolution and field of view
  • 30mm Super Long Working Distance — ideal for large or enclosed specimens
  • EPI (reflected light) design for surface and opaque sample inspection
  • Plan Fluor optical correction for flat, edge-to-edge field uniformity
  • CFI60-2 infinity-corrected system — compatible with Nikon industrial and upright microscopes
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Product Overview

The Nikon CFI60-2 T Plan Fluor EPI SLWD 20x is purpose-built for industrial and materials science microscopy where conventional objectives fall short. Its 30mm working distance — far exceeding standard objectives — allows inspection of components inside housings, wafers in carriers, or specimens under environmental chambers without risk of contact. The Plan Fluor optical design ensures excellent flatness of field and high transmission across visible wavelengths, making it equally effective for visual inspection and camera-based imaging. As part of Nikon's CFI60-2 infinity-corrected platform, it integrates seamlessly with Nikon's LV, MM, and Eclipse industrial series microscopes.

Technical Specifications

Manufacturer Nikon
Model / Part Number CFI60-2 T Plan Fluor EPI SLWD 20x / MUE31200
Magnification 20x
Numerical Aperture (N.A.) 0.3
Working Distance (W.D.) 30.0 mm
Optical System CFI60-2 Infinity-Corrected
Illumination Type EPI (Reflected Light)
Optical Correction Plan Fluor
Working Distance Class SLWD (Super Long Working Distance)
Immersion Medium Dry (Air)
Country of Origin Japan

Microscope Compatibility

Typical Applications

Semiconductor wafer and die inspection
PCB and electronic component surface analysis
Metallurgical and materials surface examination
Quality control of precision-machined parts
Inspection of specimens inside enclosures or fixtures
Failure analysis and reverse engineering

  • Designed for Mixed-Brand Lab Environments

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    Ideal for labs using multiple microscope platforms

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