Nikon 10x CF IC Epi Plan DI Mirau Interferometry Objective

The Nikon 10× CF IC Epi Plan DI Mirau Interferometry Objective (MUL40101) is a specialized optical component designed for non-contact optical profilometry and surface topography measurement. This objective incorporates a Mirau interferometer configuration, enabling precise three-dimensional surface mapping with vertical resolution to within a fraction of the wavelength of light — typically achieving sub-nanometer measurement precision.

In the Mirau interferometry design, a semi-transparent reference mirror is integrated within the objective itself, positioned between the objective lens and the sample. Incident light is split into two beams: one reflects from the reference surface within the objective, while the other reflects from the sample surface. When these beams recombine, they create an interference pattern (interferogram) that encodes the height variations of the sample surface. Advanced software analyzes this interference pattern to generate precise 3D surface maps, roughness parameters, and dimensional measurements.

The 10× magnification and 0.30 numerical aperture provide an optimal balance between field of view and lateral resolution, making this objective ideal for measuring features ranging from micrometers to millimeters in lateral extent. The 7.4mm working distance offers excellent clearance for accommodating samples with varied topography, tilted surfaces, or measurement fixtures, while maintaining the precision required for interferometric measurement.

The CF IC (Crystal Focus Infinity Corrected) optical design ensures compatibility with Nikon's infinity-corrected microscope systems, enabling integration with tube lenses, beam splitters, and camera systems for advanced measurement workflows. The Epi Plan DI designation indicates optimized performance for reflected light (epi-illumination) applications with differential interference capabilities.

This objective is essential for applications requiring non-contact, non-destructive surface measurement where mechanical profilometry would damage delicate surfaces or where sub-micrometer vertical resolution is required. The interferometric approach provides true 3D data rather than simple 2D imaging, enabling quantitative analysis of surface roughness, step heights, flatness, and complex topographical features.

This unit is brand new, ready for integration into precision metrology and surface characterization systems.