Nikon CFI TU Plan ELWD 100x Reflected Light Objective (NA 0.80, Infinity)
Regular price
$6,100.00
The Nikon CFI TU Plan ELWD 100× Reflected Light Objective (NA 0.80) is an extra-long working distance (ELWD) infinity-corrected reflected light objective designed for industrial inspection, materials science, and semiconductor applications — delivering high-resolution 100× reflected light imaging with an exceptional 4.5mm working distance that provides ample clearance for large, thick, or mounted specimens that cannot be accommodated by standard short-working-distance objectives.
KEY FEATURES
- Extra-long working distance: 4.5mm — exceptional clearance at 100× magnification for imaging large, thick, or mounted specimens, wafers, PCBs, and components that standard 100× objectives cannot reach
- NA 0.80 at 100× — high numerical aperture for excellent resolution and contrast in reflected light brightfield, DIC, and darkfield imaging
- Reflected light (epi-illumination) design — optimized for incident light microscopy of opaque specimens including metals, semiconductors, ceramics, and polished surfaces
- Infinity-corrected, M25 thread — compatible with Nikon CFI series upright and industrial microscopes including Eclipse LV, MA, and Ni series
- 🇯🇵 Nikon quality, made in Japan — precision optical construction for consistent, high-efficiency light transmission and long service life
- New — catalog number MUE21900
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Technical Specifications
| Catalog Number | MUE21900 |
| Magnification | 100× |
| Numerical Aperture (NA) | 0.80 |
| Working Distance | 4.5mm (ELWD) |
| Immersion Medium | Dry (air) |
| Optical Design | CFI TU Plan ELWD (Extra-Long Working Distance) |
| Illumination | Reflected light (epi-illumination) |
| Correction | Infinity-corrected |
| Thread / Mount | M25 |
| Compatible Microscopes | Nikon CFI Eclipse LV, MA, Ni series |
| Country of Origin | Japan |
| Condition | New |
| SKU | MUE21900 |
Microscope Compatibility
Typical Applications
Semiconductor wafer and die inspection at 100× with extended working clearance
PCB and electronics component inspection of thick or mounted assemblies
Metallographic examination of large or mounted metal specimens
Ceramics, glass, and advanced materials surface inspection
Quality control inspection of polished and coated surfaces
Any application where standard 100× working distance is insufficient for the specimen
