Olympus MXPLFLN 20X Objective

Premium 20× semi-apochromatic objective with ultra-high 0.60 numerical aperture and exceptional field flatness — ideal for maximum resolution imaging, image stitching, and advanced industrial microscopy.

• 🔬 20× Magnification, NA 0.60 — Ultra-high numerical aperture for maximum resolution and exceptional light-gathering capability.
• 🎯 Superior Field Flatness — Exceptional image uniformity from center to edge, ideal for image stitching and large-area documentation.
• ✨ Semi-Apochromatic Correction — Excellent color correction and image quality across the visible spectrum.
• 📐 Extended Field of View — Larger viewing area compared to standard objectives for improved throughput.
• 🔬 Novel Manufacturing Technology — Simultaneously optimized NA, working distance, and field flatness for breakthrough performance.

🔧 Product Description

The Olympus MXPLFLN 20× Objective represents the absolute pinnacle of industrial microscopy optics, featuring an extraordinary 0.60 numerical aperture — the highest available for a 20× objective. This flagship lens combines breakthrough resolution, exceptional field flatness, and extended field of view through novel manufacturing technology that simultaneously optimizes parameters that traditionally require trade-offs.

The ultra-high 0.60 numerical aperture delivers resolution that approaches objectives of much higher magnification, revealing the finest details in microstructures, grain boundaries, defects, and surface features with unparalleled clarity. This exceptional light-gathering capability also enables imaging of low-contrast features and provides superior performance in challenging lighting conditions. For semiconductor failure analysis, advanced metallography, and precision materials characterization, this objective sets the standard for what is achievable at 20× magnification.

The MXPLFLN series represents Olympus's most advanced objective design, created using novel manufacturing technology that breaks through traditional optical limitations. Conventional objectives must compromise between numerical aperture, working distance, and field flatness — improving one parameter typically degrades the others. The MXPLFLN design simultaneously achieves high NA (0.60), practical working distance (3.0 mm), and superior field flatness, delivering performance that was previously impossible.

Superior field flatness is a defining characteristic of the MXPLFLN series. Unlike conventional objectives where image quality degrades toward the edges, this objective maintains exceptional sharpness and uniformity from the center to the periphery of the field of view. This feature is critical for image stitching applications, where multiple overlapping fields are combined to create large-area panoramic images. Consistent focus and illumination across the entire field ensure seamless stitching without visible boundaries or focus variations.

The extended field of view provided by the MXPLFLN design allows you to observe a significantly larger sample area at 20× magnification compared to standard objectives. This improves workflow efficiency and throughput by reducing the need for frequent stage repositioning and enables better contextual understanding of features within the broader sample structure. For production environments and high-volume inspection, this translates directly to increased productivity.

The semi-apochromatic optical design delivers excellent color correction across the visible spectrum, ensuring accurate color rendition, high contrast, and sharp imaging essential for photomicrography, digital documentation, and quantitative image analysis. The plan fluorite construction provides the flat-field imaging that makes the MXPLFLN series ideal for automated inspection and image analysis applications.

Designed for reflected light industrial microscopy, this objective features a standard RMS thread mount and is fully compatible with Olympus BX, GX, MX, and BHM series microscope systems. The robust Japanese construction ensures reliable performance in demanding production and research environments where the highest image quality, precision, and repeatability are essential.

🔎 Typical Applications

• Maximum resolution metallography and microstructure analysis
• Semiconductor wafer inspection and failure analysis
• Image stitching and large-area panoramic imaging
• Automated inspection and image analysis
• Advanced materials characterization and research
• High-throughput quality control and documentation

📊 Key Specifications

💼 University Purchase Orders Accepted

Thank you for viewing! Please contact us with any questions about this objective or your specific industrial microscopy requirements.