Olympus ULWD MIRPLAN 5X IR Objective

Ultra-long working distance 5× IR objective with high NA — ideal for near-infrared imaging with exceptional clearance.

• 🔬 5× Magnification, NA 0.40 — High numerical aperture for excellent resolution in IR imaging.
• 🔴 Infrared (IR) Optimized — Corrected for near-infrared wavelengths, ideal for silicon wafer inspection and IR applications.
• 📏 Ultra-Long Working Distance (20 mm) — Exceptional clearance for thick specimens, probe stations, and in-situ testing.
• 🧠 MIRPLAN Optical Design — Delivers high-performance imaging optimized for infrared wavelengths.
• ⚙️ RMS Thread Mount — Standard threaded mount for broad microscope compatibility.

🔧 Product Description

The Olympus ULWD MIRPLAN 5× IR Objective is a specialized ultra-long working distance objective engineered for demanding near-infrared imaging applications. Combining a remarkable 20 mm working distance with a high numerical aperture of 0.40, this objective delivers exceptional resolution and clearance for semiconductor inspection, silicon wafer analysis, and advanced IR microscopy applications.

The ultra-long working distance (ULWD) of 20 mm is a critical advantage for applications requiring extensive specimen clearance. This exceptional working distance enables inspection of thick samples, accommodates probe stations and micromanipulators, and provides ample room for in-situ testing and measurements. The extended clearance also dramatically reduces the risk of objective damage from contact with specimens or equipment, protecting your investment in precision optics.

Despite the ultra-long working distance, this objective maintains a high numerical aperture of 0.40 — significantly higher than typical long working distance objectives. This high NA delivers excellent resolution and light-gathering capability, enabling detailed imaging of fine structures in the infrared spectrum. The combination of long working distance and high NA makes this objective uniquely capable for challenging IR imaging applications.

Optimized for near-infrared wavelengths, this objective enables imaging through materials that are opaque in visible light but transparent in the IR spectrum. Silicon, which is opaque to visible light, becomes transparent in the near-IR, allowing you to inspect internal structures, defects, and features within silicon wafers and integrated circuits without destructive sectioning.

The MIRPLAN optical design ensures high-performance imaging optimized specifically for infrared wavelengths. Compatible with microscopes via standard RMS thread mount, this objective integrates seamlessly into semiconductor, materials science, and photonics research workflows. Requires an IR-sensitive camera and appropriate illumination for infrared imaging.

🔎 Typical Applications

• Silicon wafer and IC inspection through silicon
• Semiconductor failure analysis with probe stations
• In-situ electrical testing and measurements
• Photonics and optoelectronics research
• Near-infrared spectroscopy and imaging
• Materials characterization requiring high clearance

📊 Key Specifications

💼 University Purchase Orders Accepted

Thank you for viewing! Please contact us with any questions about this objective or your specific near-infrared microscopy requirements.